Descrição
Stencil For iPhone 7 Audio IC and Power Logic Module Description
The 3D feature of the Qianli Toolplus stencil makes fixing your chip much easier and 100% accurate.
Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil. Use this stencil to reball the Audio IC on iPhone 7
Tips
-Please check your model before ordering.
Package Content
1 x 3D iBlack Stencil For iPhone 7 Audio IC and Power Logic Module
Packing Details
-Weight: 0.03 KG
-Estimated Shipping Weight: 0.14 Kg
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