Kaisi A11 iPhone 3D BGA Planting Stencil

WitrigsSKU: 119148

価格:
販売価格¥2,800 JPY

説明

Kaisi A11 iPhone 3D BGA Planting Stencil

-Brand new and high quality 3D BGA Planting Stencil.

-Made of plastic material.

-Stepped groove design enables stencil to align with tinning position of IC rapidly.

-The square holes design makes it easier to take out the formed solder balls.

-This 3D stencil is easy to use no matter you are a new or expert.

-High success rate of planting tin, the solder balls can be formed once after you are proficient.

-This 3D planting stencil is thicker than ordinary stencil in the market. Less tendency of deformation makes its using life be longer.

Tips

-Please check your model before ordering.

Package Content

1 x Kaisi A11 iPhone 3D BGA Planting Stencil

Packing Details

-Weight: 0.02 KG

-Packing Size: 8.5 × 6.9 × 0.1 (CM)

-Estimated Shipping Weight: 0.04 KG

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All of our products are triple-tested and meet strict quality standards.

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