説明
Kaisi A11 iPhone 3D BGA Planting Stencil
-Brand new and high quality 3D BGA Planting Stencil.
-Made of plastic material.
-Stepped groove design enables stencil to align with tinning position of IC rapidly.
-The square holes design makes it easier to take out the formed solder balls.
-This 3D stencil is easy to use no matter you are a new or expert.
-High success rate of planting tin, the solder balls can be formed once after you are proficient.
-This 3D planting stencil is thicker than ordinary stencil in the market. Less tendency of deformation makes its using life be longer.
Tips
-Please check your model before ordering.
Package Content
1 x Kaisi A11 iPhone 3D BGA Planting Stencil
Packing Details
-Weight: 0.02 KG
-Packing Size: 8.5 × 6.9 × 0.1 (CM)
-Estimated Shipping Weight: 0.04 KG
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