Descrizione
Solder paste for Phone Repair 138°
-Brand new and high quality Mechanic Solder Paste.
Solder paste for Phone Repair 138° is an essential tool during heating process for soldering work. It can be used for rework, sphere attachment to BGA, CGA and CSP packages.
Features:
Long stencil life
Wide process window
Excellent wetting compatibility on most board finishes
Low voiding
Compatible with enclosed printing heads
Package Content
1 x Solder paste for Phone Repair 138°
Packing Details
-Weight: 0.05 KG
-Estimated Shipping Weight: 0.09 KG
Find what you need
Tell us what mobile phone parts you need and we will find them for you.
Repair with confidence
All of our products are triple-tested and meet strict quality standards.
Fast and high quality delivery
We support delivery to many countries around the world.