Descripción
BGA Welding Mould
Suitable for reballing eMMC Chips BGA221, BGA153, BGA169, BGA254, BGA162, BGA186
Tips
-Please check your model before ordering.
Package Content
1 x BGA Welding Mould
Packing Details
-Weight: 0.32 KG
-Packing Size: 18.5 × 8.8 × 1.2 (CM)
-Estimated Shipping Weight: 0.42 KG
Find what you need
Tell us what mobile phone parts you need and we will find them for you.
Repair with confidence
All of our products are triple-tested and meet strict quality standards.
Fast and high quality delivery
We support delivery to many countries around the world.