Description
BGA Welding Mould
Suitable for reballing eMMC Chips BGA221, BGA153, BGA169, BGA254, BGA162, BGA186
Tips
-Please check your model before ordering.
Package Content
1 x BGA Welding Mould
Packing Details
-Weight: 0.32 KG
-Packing Size: 18.5 × 8.8 × 1.2 (CM)
-Estimated Shipping Weight: 0.42 KG
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Quality Accessories
We only sell ORIGINAL mobile phone parts.
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