Beschreibung
Solder paste for Phone Repair 138°
-Brand new and high quality Mechanic Solder Paste.
Solder paste for Phone Repair 138° is an essential tool during heating process for soldering work. It can be used for rework, sphere attachment to BGA, CGA and CSP packages.
Features:
Long stencil life
Wide process window
Excellent wetting compatibility on most board finishes
Low voiding
Compatible with enclosed printing heads
Package Content
1 x Solder paste for Phone Repair 138°
Packing Details
-Weight: 0.05 KG
-Estimated Shipping Weight: 0.09 KG
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Tell us what mobile phone parts you need and we will find them for you.
Quality Accessories
We only sell ORIGINAL mobile phone parts.
Fast and high quality delivery
We support delivery to many countries around the world.
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