Description
Solder paste for Phone Repair 138°
-Brand new and high quality Mechanic Solder Paste.
Solder paste for Phone Repair 138° is an essential tool during heating process for soldering work. It can be used for rework, sphere attachment to BGA, CGA and CSP packages.
Features:
Long stencil life
Wide process window
Excellent wetting compatibility on most board finishes
Low voiding
Compatible with enclosed printing heads
Package Content
1 x Solder paste for Phone Repair 138°
Packing Details
-Weight: 0.05 KG
-Estimated Shipping Weight: 0.09 KG
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Quality Accessories
We only sell ORIGINAL mobile phone parts.
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